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01/12/2010

Exhibition Information of The nearest exhibition

Place: Tokyo Big Sight
Date: 1/20-1/22

<ELECTRONIC EQUIPMENT 1ST DIV.>

INTERNEPCON JAPAN http://www.nepcon.jp/english
■centrothermthermal solutions Gmbh+Co.KG
Vacuum soldering system. Void less. Flux less. Ultra clean.
■IBS Inc.
NANO-PED
Ultra-atomization unit for wet mode without using medium
for Pulverization, Dispersion and Emulsification
No check valve used.

Automotive Electronics Technology Expo
http://www.car-ele.jp/carele/en/
■Temptronic
The source for complete Thermal Test Solution

<SEMICONDUCTOR DEVICES FIRST DIV.>

Photonics Japan 2010
http://www.laseropt.jp/laser/en/
■Ocean Optics .Inc
Compact spectro meter USB4000
■Fine device
Resin welding machine by laser
■ARGES
Galvano scan heads 2D and 3D

FIBER OPTICS EXPO
http://www.foe.jp/foe/english/
■JDSU
Component product for optical networking
Subsystem product
Optical Transport tester
■Mintera
40GHz DPSK transponder
■Bayspec
Optical Channel Monitor
■Optoplex
Optical Interleaver
Demodulator
■AFOP
Passive component
■Proximion
Dispersion Componensation Module
■CrossFiber
Photonics Cross Connect