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01/08/2008

Exhibition Information of The nearest exhibition

Exhibition Information of The nearest exhibition

Place: Tokyo Big Sight
Date: 1/16-1/18

■ELECTROTEST JAPAN

【ELECTRONIC EQUIPMENT 1ST DIV.】Booth No: 2-27
・X-ray inspection system of I-Bit CO.,LTD
Compact and high-resolution system
・ThermoStream System of TEMPTRONIC CORPORATION
High-speed-thermal-forcing-system for thermal test
・Surface Probe Microscope of SII NanoTechnology Inc.
High-resolution surface imaging system

【ELECTRONIC EQUIPMENT 2ND DIV. [Co-Exhibitor: MIRTEC CO.,Ltd. ]】Booth No: 2-49
・AOI (Desktop Type) of MIRTEC Co.,Ltd.
MV-3 High Performance DeskTop Model
・In-Line AOI with Laser System of MIRTEC Co.,Ltd.
MV-6 In-Line AOI System with Laser
・In-Line AOI System of MIRTEC Co.,Ltd.
MV-7 Standard In-Line AOI System

URL: http://www.electrotest.jp/english

■INTERNEPCON JAPAN

【ELECTRONIC EQUIPMENT 1ST DIV.】Booth No: 58-7
・centrotherm thermal solutions Gmbh+Co.KG
Vacuum soldering system. Void less. Flux less. Ultra clean.

URL: http://www.nepcon.jp/english

■LASER & OPTICS

【ELECTRONIC EQUIPMENT 1ST DIV.】Booth No: 38-31
・newport corporation
optics component
・OceanOptics.Inc
Ocean optics USB4000
・ARGES
Welding for Industry
・Spiricon
hihg level beam analyzer

URL: http://www.laseropt.jp/english

■FIBER OPTICS EXPO
【Semiconductor Devices First Div.】Booth No: 6-2
・Component product for optical networking of JDSU
・Optical transciever module of JDSU
・Subsystem product of JDSU
・Measurement Instrument of JDSU
・Optical Channel Monitor of Bayspec

URL: http://www.foe.jp/foe/english/